PCB SIM MGR II R&D/PRODUCT DVL ENGINEERING

Job Overview

TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems.

Required Skills

Bachelor’s degree in Electrical Engineering or equivalent work experience; Master's Degree preferred
•    Minimum of 10 years of relevant work experience in electrical Design, RF design or PCB design, 12-15+ preferred
•    Minimum of 5 years of progressive leadership and people management experience in a multi-national or regional environment
•    A solid understanding of electromagnetic theory and electrical circuit behavior
•    Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
•    Expert with printed circuit board layout and design (Altium and/or Cadence preferred), fabrication and assembly, especially as associated with connector and card-edge interfaces
•    Strongly proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration
•    Proficient with high-speed test equipment (VNA, TDR, BERT)
•    Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.
•    Familiar with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)
•    Familiar with high-volume manufacturing processes
•    Familiar with signal conditioning techniques (equalization, amplification)
•    Practiced analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.
•    Exposure to physical layer communications systems and architectures
•    Fluent in English (both verbal and written)
•    Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.
•    Expert problem solver – able to solve high complexity situations with little to no direction. Proactive in identifying complex issues, providing solutions, and driving improvements to evolve procedures
•    Proficient in presenting technical solutions to customers and upper management
•    Demonstrated experience leading/developing a team of 5+ experienced professionals who exercise latitude and independence in their assignments with accountability for team performance, project delivery, and resource allocation.
•    Proficient in building and leading a solid team - assessing talent fit (current team and future hires), aligning skills to business needs, identifying skillset gaps needed to strengthen the team, and taking actions necessary to maintain solid team performance.
•    Proficient at leading cross-functional new product development projects which require strong collaboration and influencing skills to achieve the right outcome for the business.
•    Proficient in driving a data analytics mindset across the team – identifying the most meaningful data to collect, analyzing it, drawing conclusions, and presenting those conclusions as data intelligence to provide insight and drive innovative solutions for the business.
•    Proficient at driving continuous improvement with demonstrated experience implementing best practices to enhance engineering efficiency
 

Responsiblities

•    Manage and lead a team of regional signal integrity engineers in establishing signal integrity design performance and functional requirements for new products
•    Lead the team to perform signal integrity simulations for multiple high-speed standards 56G/112G/224G/ and faster, on each product. This includes determining the correct simulation methodology and setup to use, as well as working with global engineering teams to both gather inputs and provide results.
•    Guide the team in product design and analysis from a signal integrity standpoint with a focus on making data driven decisions about the product functionality and areas for improvement.
•    Create actionable recommendations based upon design reviews and simulation results.
•    Align the technology roadmap with the market trends, customer needs, and implement accordingly.
•    Drive a culture of innovation using a base of traditional approaches and external knowledge to develop innovative solutions.
•    Effectively build and lead a regional team of SI engineers of varying levels of experience with different backgrounds, experiences, and cultures.
•    Drive high performance by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability.  And track performance through metrics to demonstrate productivity and growth.
•    Manage employee wellbeing by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives.

Competencies